Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09728683
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Filing Dt:
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11/29/2000
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Publication #:
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Pub Dt:
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05/30/2002
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Inventors:
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Madhav Datta, Valery M. Dubin, Paul J. McGregor, Christopher D. Thomas
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Title:
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Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| DONNA JO CONINGSBY |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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