Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/20/2003
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Application #:
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09731148
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Filing Dt:
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12/05/2000
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Publication #:
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Pub Dt:
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06/06/2002
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Inventors:
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Louis L. Hsu, Jack A. Mandelman, William R. Tonti, Carl J. Radens, Richard A. Strub
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Title:
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FORMING ELECTRONIC STRUCTURES HAVING DUAL DIELECTRIC THICKNESSES AND THE STRUCTURE SO FORMED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM MICROECLECTRONICS |
| RICHARD A. HENKLER |
| INTELLECTUAL PROPERTY LAW |
| 1000 RIVER STREET, 972 E |
| ESSEX JUNCTION, VT 05452 |
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