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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/22/2004
Application #:
09731226
Filing Dt:
12/04/2000
Publication #:
Pub Dt:
06/06/2002
Inventor:
Rajeev Joshi
Title:
PASSIVATION SCHEME FOR BUMPED WAFERS
Assignment: 1
Reel/Frame:
011622/0288Recorded: 03/05/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/14/2001
Assignee:
82 RUNNING HILL ROAD, MS 35-4E
SOUTH PORTLAND, MAINE 04106
Correspondent:
TOWNSEND AND TOWNSEND AND CREW LLP
KEVIN T. LEMOND
TWO EMBARCADERO CENTER, 8TH FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834
Assignment: 2
Reel/Frame:
057694/0374Recorded: 08/03/2021Pages: 381
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2021
Assignee:
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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