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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10007277
Filing Dt:
10/26/2001
Publication #:
Pub Dt:
06/13/2002
Inventors:
Takashi Kataoka, Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri
Title:
Making and using an ultra-thin copper foil
Assignment: 1
Reel/Frame:
012378/0443Recorded: 10/26/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/24/1998
Exec Dt:
04/24/1998
Exec Dt:
04/24/1998
Exec Dt:
04/24/1998
Assignee:
656-2 KAMAKURABASHI AGEO-SHI
SAITAMA-KEN, JAPAN 362
Correspondent:
ARNOLD, WHITE & DURKEE
STEPHEN G. RUDISILL
P.O. BOX 4433
HOUSTON, TX 77210

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