Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09996349
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Filing Dt:
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11/27/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Inventor:
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Shinichi Koriyama
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Title:
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Wiring substrate, wiring board, and wiring substrate mounting structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FUSHIMI-KU |
| 6, TAKEDA TOBADONO-CHO |
| KYOTO 612-8501, JAPAN |
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| HOGAN & HARTSON LLP |
| MICHAEL CRAPENHOFT ESQ |
| 500 SOUTH GRAND AVENUE SUITE 1900 |
| LOS ANGELES, CA 90071 |
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