Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09888642
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Filing Dt:
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06/26/2001
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Publication #:
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Pub Dt:
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07/04/2002
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Inventors:
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Toshio Haba, Takeyuki Itabashi, Shinichi Fukada, Haruo Akahoshi
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Title:
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Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| WILLIAM I. SOLOMON |
| 1300 NORTH 17TH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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