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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10029839
Filing Dt:
12/31/2001
Publication #:
Pub Dt:
07/11/2002
Inventor:
Jun Nishihara
Title:
Method of fabricating semiconductor device and polishing apparatus used therefor
Assignment: 1
Reel/Frame:
012680/0226Recorded: 03/07/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/28/2002
Assignee:
SHINAGAWA-KU
7-35 KITASHINAGAWA 6-CHOME
TOKYO, JAPAN
Correspondent:
RADER, FISHMAN & GRAUER
RONALD P. KANANEN, ESQ.
1233 20TH STREET, NW - SUITE 501
WASHINGTON, D.C. 20036

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