Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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10046446
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Filing Dt:
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01/16/2002
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Publication #:
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Pub Dt:
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07/18/2002
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Inventors:
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Toshio Miyamoto, Ichiro Anjo, Asao Nishimura, Yoshihide Yamaguchi, Mitsuaki Katagiri et al
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Title:
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WAFER LEVEL CHIP SIZE PACKAGE HAVING REROUTING LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU, JAPAN |
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| MATTINGLY, STRANGER & MALUR, P.C. |
| JOHN R. MATTINGLY |
| 1800 DIAGONALL ROAD, SUITE 370 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| JOHN R. MATTINGLY, ESQ. |
| 1800 DIAGONAL RD. |
| SUITE 370 |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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MERGER AND CHANGE OF NAME
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| MATTINGLY & MALUR, P.C. |
| 1800 DIAGONAL RD. |
| SUITE 370 |
| ALEXANDRIA, VA 22314 |
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