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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09770052
Filing Dt:
01/24/2001
Publication #:
Pub Dt:
07/25/2002
Inventors:
Wen Chuan Chen, Kuo Feng Peng, C. H. Chou, Allis Chen, Nai Hua Yeh, Wu Hsiang Lee et al
Title:
Integrated circuit structure having an adhesive agent and method for manufacturing the same
Assignment: 1
Reel/Frame:
011505/0163Recorded: 01/24/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Exec Dt:
01/03/2001
Assignee:
NO. 84, TAIHO ROAD, CHUPEI
HSINCHU HSIEN, TAIWAN R.O.C
Correspondent:
PRO-TECHTOR INTERNATIONAL
KEITH KLINE
20775 NORADA COURT
SARATOGA, CA 95070-3018

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