Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09504007
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Filing Dt:
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02/14/2000
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Publication #:
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Pub Dt:
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08/01/2002
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Inventor:
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Thomas P. Glenn
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Title:
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Method of forming an integrated circuit device package using a temporary substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 95248 |
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| SKJERVEN, MORRILL, MACPHERSON ET AL |
| JAMES F. PARSONS |
| 25 METRO DRIVE |
| SUITE 700 |
| SAN JOSE, CA 95110 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 FINANCIAL SQUARE, 30TH FLOOR |
| S.G. COWEN SECURITY CORPORATION |
| NEW YORK, NEW YORK 10005 |
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| SHEARMAN & STERLING |
| ANTOINETTE E. BAKER |
| 599 LEXINGTON AVENUE |
| NEW YORK, NY 10022 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 390 GREENWICH STREET |
| NEW YORK, NEW YORK 10013 |
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| WEIL, GOTHSHAL & MANGES LLP |
| BETH A. OLIAK, ESQ. |
| 767 FIFTH AVENUE |
| NEW YORK, NEW YORK 10153 |
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