Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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09771636
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Filing Dt:
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01/30/2001
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Publication #:
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Pub Dt:
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08/01/2002
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Inventors:
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Fumio Harada, Kazuharu Konishi, Yoshihiro Masada, Toshio Nakaike
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Title:
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METHOD AND APPARATUS FOR BONDING EXTRUSION-MOLDED OR DIE MOLDED PIECES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-8, MISASA-MACHI 2-CHOME, NISHI-KU, HIROSHIMA-SHI |
| HIROSHIMA 733-8510, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS PLLC |
| MARK BOLAND |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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