Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09906794
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Filing Dt:
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07/18/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Inventors:
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Hideki Ishii, Kazunari Michii, Jun Shibata, Moriyoshi Nakashima
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Title:
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DUAL PACKAGE SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8 |
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| LEYDIG, VOIT & MAYER, LTD. |
| JEFFREY A. WYAND |
| 700 THIRTEENTH STREET, N.W., SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, |
| KANAGAWA, JAPAN 211-8668 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 THIRTEENTH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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