Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10068585
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Filing Dt:
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02/05/2002
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Publication #:
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Pub Dt:
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08/08/2002
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Inventors:
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Ki Wook Lee, Dae Keun Park
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Title:
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Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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| WEISS & MOY, P.C. |
| JEFFREY D. MOY |
| 4204 NORTH BROWN AVENUE |
| SCOTTSDALE, ARIZONA 85251-3914 |
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