Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/04/2004
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Application #:
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10003227
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Filing Dt:
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12/06/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Inventors:
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Yoshihisa Saimoto, Yasuhisa Fujii, Makoto Kataoka, Takanobu Koshimizu, Hideki Fukumoto et al
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Title:
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PROTECTING METHOD FOR SEMICONDUCTOR WAFER AND SURFACE PROTECTING ADHESIVE FILM FOR SEMICONDUCTOR WAFER USED SAID METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2-5, KASUMIGASEKI 3-CHOME, CHIYODA-KU |
| TOKYO, 100-6070, JAPAN |
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| BURNS, DOANE, SWECKER & MATHIS, L.L.P. |
| ROBERT G. MUKAI |
| P.O. BOX 1404 |
| ALEXANDRIA, VA 22313-1404 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUMITOMO FUDOSAN KANDA BLDG. |
| 7 KANDA, MITOSHIRO-CHO, CHIYODA-KU |
| TOKYO, JAPAN 101-8485 |
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| BUCHANAN INGERSOLL & ROONEY PC |
| 1737 KING ST |
| SUITE 500 |
| ALEXANDRIA, VA 22314 |
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