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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09164366
Filing Dt:
10/01/1998
Publication #:
20020117635
Pub Dt:
08/29/2002
Inventors:
HIROYUKI SHINADA, YUSUKE YAJIMA, HISAYA MURAKOSHI, MASAKI HASEGAWA, MARI NOZOE et al
Title:
PATTERNED WAFER INSPECTION METHOD AND APPARATUS THEREFOR
Assignment: 1
Reel/Frame:
009603/0294Recorded: 11/23/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHINADA, HIROYUKI
Exec Dt:
10/20/1998
YAJIMA, YUSUKE
Exec Dt:
10/20/1998
MURAKOSHI, HISAYA
Exec Dt:
10/20/1998
HASEGAWA, MASAKI
Exec Dt:
10/21/1998
NOZOE, MARI
Exec Dt:
10/21/1998
TAKAFUJI, ATSUKO
Exec Dt:
10/21/1998
SUGIYAMA, KATSUYA
Exec Dt:
10/22/1998
KURODA, KATSUHIRO
Exec Dt:
10/23/1998
UMEMURA, KAORU
Exec Dt:
10/23/1998
USAMI, YASUTSUGA
Exec Dt:
10/23/1998
Assignee:
HITACHI, LTD.
6, KANDA SURGADAI 4-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
FAY, SHARPE, BEALL, ET AL.
THOMAS E. BEALL, JR.
104 EAST HUME AVENUE
ALEXANDRIA, VIRGINIA 22301

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