Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09973611
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Filing Dt:
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10/09/2001
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Publication #:
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Pub Dt:
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09/05/2002
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Inventors:
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Han-Ping Pu, Shih-Kuang Chiu, Keng-Yuan Liao, Chien-Ping Huang
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Title:
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FLIP CHIP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ADD THIRD INVENTOR'S NAME, PREVIOUSLY RECORDED AT REEL 0112268 FRAME 0337.
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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Assignment:
3
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RE-RECORD TO ADD THE NAME OF THE FOURTH ASSIGNOR, PREVIOUSLY RECORDED ON REEL 012597 FRAME 0922, ASSIGNOR CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDS & ANGELL, LLP |
| STEVEN M. JENSEN |
| P.O. BOX 9169 |
| BOSTON, MASSACHUSETTS 02209 |
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