Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10084787
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Filing Dt:
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02/25/2002
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Publication #:
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Pub Dt:
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09/05/2002
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Inventors:
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Rajendra Pendse, Samuel Tam
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Title:
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Super-thin high speed flip chip package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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| HAYNES BEFFEL & WOLFELD LLP |
| BILL KENNEDY |
| PO BOX 366 |
| HALF MOON BAY, CA 94019 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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| HAYNES BEFFEL & WOLFELD LLP |
| BILL KENNEDY |
| P.O. BOX 366 |
| HALF MOON BAY, CA 94019 |
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