Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09483712
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Filing Dt:
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01/14/2000
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Publication #:
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Pub Dt:
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09/12/2002
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Inventors:
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Edward A. Schrock, Tongbi Jiang
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Title:
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INTERMEDIATE STRUCTURES FOR CHIP-SCALE PACKAGES HAVING CARRIER BONDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| TRASK, BRITT & ROSSA |
| JOSEPH A. WALKOWSKI |
| P.O. BOX 2550 |
| SALT LAKE CITY, UTAH 84110-2550 |
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