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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	09915104	Filing Dt:	07/25/2001
Publication #:	20020132469	Pub Dt:	09/19/2002
Inventors:	Jong-Myeong Lee, Byung-Hee Kim, Gil-Heyun Choi, Myoung-Bum Lee, Ju-Young Yun
Title:	Method for forming metal wiring layer

Assignment: 1

Reel/Frame:

012023/0882

Recorded: 07/25/2001

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LEE, JONG-MYEONG

Exec Dt:

07/09/2001

KIM, BYUNG-HEE

Exec Dt:

07/09/2001

LEE, MYOUNG-BUM

Exec Dt:

07/09/2001

YUN, JU-YOUNG

Exec Dt:

07/09/2001

CHOI, GIL-HEYUN

Exec Dt:

07/09/2001

Assignee:

SAMSUNG ELECTRONICS, CO., LTD.

416, MAETAN-DONG, PALDAL-GU

SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Correspondent:

MILLS & ONELLO LLP

ANTHONY P. ONELLO. JR.

ELEVEN BEACON STREET, SUITE 605

BOSTON, MA 02108

Assignment: 2

Reel/Frame:

012173/0723

Recorded: 08/09/2001

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

ZIMMERMANN, ARMIN

Exec Dt:

07/23/2001

ENENKEL, PETER

Exec Dt:

07/23/2001

NOLTE, DIRK

Exec Dt:

07/28/2001

Assignee:

SIEMENS AKTIENGESELLSCHAFT

WITTELSBACHER PLATZ 2

80333 MUNCHEN, GERMANY

Correspondent:

PHILIP G. MEYERS INTELLECTUAL PROPERTY

LAW, P.C.; PHILIP G. MEYERS

3121 CROSS TIMBERS ROAD, SUITE 114

FLOWER MOUND, TX 75208

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