Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09817264
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Filing Dt:
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03/27/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Inventors:
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Wen-Chun Liu, Yung-Chao Jen, Ming-Feng Wu
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Title:
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ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, EAST 1ST ST., K.E.P.Z. |
| KAOHSIUNG,, TAIWAN |
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| PARKHURST & WENDEL, L.L.P. |
| ROGER W. PARKHURST |
| 1421 PRINCE STREET |
| SUITE 210 |
| ALEXANDRIA, VA 22314-2805 |
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