Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09823468
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Filing Dt:
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03/30/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Inventors:
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John M. Boyd, David Wei, Katrina A. Mikhaylichenko
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Title:
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Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| MARTINE PENILLA & KIM, LLP |
| PETER B. MARTINE |
| 710 LAKEWAY DRIVE, SUITE 170 |
| SUNNYVALE, CA 94085 |
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