Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10088163
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Filing Dt:
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03/15/2002
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Publication #:
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Pub Dt:
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10/17/2002
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Inventor:
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Kazutaka Shibata
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Title:
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SEMICONDUCTOR DEVICE WITH CHIP-ON-CHIP CONSTRUCTION JOINED VIA A LOW-MELTING POINT METAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO |
| UKYO-KU, KYOTO-SHI, JAPAN |
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| RADERM FISHMAN & GRAUER |
| DAVID K. BENSON |
| 1233 20TH STREET, NW, SUITE 501 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ACHLYS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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