Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10100507
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Filing Dt:
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03/18/2002
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Publication #:
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Pub Dt:
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10/24/2002
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Inventors:
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Chikao Ikenaga, Kenji Matsumura, Kunihiro Tsubosaki
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Title:
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Lead frame and semiconductor package formed using it
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHINJUKU-KU |
| 1-1 ICHIGAYA-KAGACHO 1-CHOME |
| TOKYO 162-8001, JAPAN |
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| FLYNN, THIEL, BOUTELL & TANIS, P.C. |
| DALE H. THIEL |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008-1699 |
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05/01/2024 10:49 AM
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