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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6617674
Issue Dt:
09/09/2003
Application #:
09789083
Filing Dt:
02/20/2001
Publication #:
20020158317
Pub Dt:
10/31/2002
Inventors:
Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness et al
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME
Assignment: 1
Reel/Frame:
011741/0347Recorded: 04/23/2001Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BECKER, GREGORY SCOTT
Exec Dt:
02/22/2001
GARDNER, GEOFFREY BRUCE
Exec Dt:
02/22/2001
HARKNESS, BRIAN ROBERT
Exec Dt:
02/22/2001
MALENFANT, LOUISE ANN
Exec Dt:
02/22/2001
SARMAH, SATYENDRA KUMAR
Exec Dt:
02/22/2001
Assignee:
DOW CORNING CORPORATION
P.O. BOX 994
2200 W. SALZBURG ROAD
MIDLAND, MICHIGAN 48686
Correspondent:
DOW CORNING CORPORATION
LARRY A. MILCO
2200 W. SALZBURG ROAD
P.O. BOX 994
MIDLAND, MI 48686
Assignment: 2
Reel/Frame:
045460/0278Recorded: 02/27/2018Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
DOW CORNING CORPORATION
Exec Dt:
02/01/2018
Assignee:
DOW SILICONES CORPORATION
2200 WEST SALZBURG ROAD
MIDLAND, MICHIGAN 48686
Correspondent:
BRENDA BOSCO
2040 DOW CENTER
MIDLAND, MI 48674

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