Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10127927
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Filing Dt:
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04/23/2002
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Publication #:
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Pub Dt:
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10/31/2002
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Inventors:
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Toshihide Ito, Shiro Hara
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Title:
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Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-2, YAESU |
| CHUO-KU, TOKYO, JAPAN 104-0028 |
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| MICHAEL BEST & FRIEDRICH LLC |
| PERRY J. HOFFMAN |
| 401 NORTH MICHIGAN AVENUE |
| SUITE 1900 |
| CHICAGO, IL 60611 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-2-7, YAESU, CHUO-KU |
| TOKYO 104-0028, JAPAN |
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| LISA C. CHILDS |
| MICHAEL BEST & FRIEDRICH LLP |
| 401 N. MICHIGAN AVENUE |
| SUITE 1900 |
| CHICAGO, IL 60611 |
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