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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09879779
Filing Dt:
06/12/2001
Publication #:
Pub Dt:
11/14/2002
Inventors:
Noriaki Oda, Toshiyuki Takewaki, Manabu Iguchi, Yoshihisa Matsubara
Title:
Semiconductor device with multilayer wiring structure of laminated damascene wiring and fabrication method thereof
Assignment: 1
Reel/Frame:
011902/0346Recorded: 06/12/2001Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/05/2001
Exec Dt:
06/05/2001
Exec Dt:
06/05/2001
Exec Dt:
06/05/2001
Assignee:
MINATO-KU
7-1, SHIBA 5-CHOME
TOKYO, JAPAN
Correspondent:
HELGOTT & KARAS, P.C.
AARON B. KARAS
EMPIRE STATE BUILDING
60TH FLOOR
NEW YORK, NY 10118
Assignment: 2
Reel/Frame:
013745/0188Recorded: 02/19/2003Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE
NAKAHARA-KU, KAWASAKI
KANAGAWA 211-8668, JAPAN
Correspondent:
KATTEN MUCHIN ZAVIS ROSENMAN
IP DEPARTMENT 15TH FL.
575 MADISON AVENUE
NEW YORK, NY 10022-2585

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