Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09482102
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Filing Dt:
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01/13/2000
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Publication #:
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Pub Dt:
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11/21/2002
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Inventors:
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RAJ N MASTER, MOHAMMED ZUBAIR KHAN, MARIA GUARDADO, CHARLES ANDERSON
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Title:
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ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 3453 |
| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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| MCDERMOTT, WILL & EMERY |
| DANIEL BUCCA |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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