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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10147903
Filing Dt:
05/20/2002
Publication #:
Pub Dt:
11/21/2002
Inventor:
Takashi Miyazaki
Title:
Flip-chip-type semiconductor device and manufacturing method thereof
Assignment: 1
Reel/Frame:
012921/0660Recorded: 05/20/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/08/2002
Assignee:
MINATO-KU
7-1, SHIBA 5-CHOME
TOKYO, JAPAN
Correspondent:
YOUNG & THOMPSON
YOLANDA REYNOLDS
745 S. 23RD ST., 2ND FL.
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
013650/0020Recorded: 05/13/2003Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2002
Assignee:
1753 SHIMONUMABE
NAKAHARA-KU, KAWASAKI
KANAGAWA, JAPAN 211-8668
Correspondent:
YOUNG & THOMPSON
ROLAND E. LONG, JR.
745 SOUTH 23RD STREET
SECOND FLOOR
ARLINGTON, VA 22202

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