Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10021372
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Filing Dt:
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10/30/2001
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Publication #:
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Pub Dt:
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11/21/2002
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Inventors:
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Gerard S. Moloney, Huey-Ming Wang, Scott Chin, John J. Geraghty, William Dyson JR. et al
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Title:
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Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11-1, HANEDA ASAHI-CHO |
OHTA-KU, TOKYO 144-8510, JAPAN |
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DORSEY & WHITNEY LLP |
R. MICHAEL ANANIAN, ESQ. |
SUITE 3400 |
FOUR EMBARCADERO CENTER |
SAN FRANCISCO, CA 94111-4187 |
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