Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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10088479
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Filing Dt:
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03/20/2002
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Publication #:
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Pub Dt:
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11/28/2002
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Inventors:
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Kenji Morimoto, Hiroshi Ochi
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Title:
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FLIP CHIP PACKAGE, CIRCUIT BOARD THEREOF AND PACKAGING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA KADOMA-SHI |
| OSAKA, JAPAN 571-8 |
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| PARKHURST & WENDEL, L.L.P. |
| ROGER W. PARKHURST |
| 1421 PRINCE STREET |
| SUITE 210 |
| ALEXANDRIA, VA 22314-2805 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| PANASONIC CORPORATION |
| 2-1-61, SHIROMI, CHUO-KU |
| 7F OBP PANASONIC TOWER |
| OSAKA, 540-6207 JAPAN |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 303 TERRY FOX DRIVE, SUITE 300 |
| OTTAWA, CANADA K2K 3J1 |
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| COLLABO INNOVATIONS, INC. |
| 303 TERRY FOX DRIVE, SUITE 300 |
| OTTAWA, K2K 3J1 CANADA |
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Assignment:
4
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LIEN (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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| COLLABO INNOVATIONS, INC. |
| 600 ANTON BLVD. SUITE 1350 |
| COSTA MESA, CA 92626 |
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