Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
06/24/2003
|
Application #:
|
09916772
|
Filing Dt:
|
07/27/2001
|
Publication #:
|
|
Pub Dt:
|
12/05/2002
| | | | |
Inventors:
|
Jong-Sung Jung, Jong-Tae Kim, Guem-Young Youn, Chang-Dug Kim
|
Title:
|
LEAD BONDING METHOD FOR SMD PACKAGE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
314 MAETAN-3-DONG, PALDAL-KU, SUWON |
KYUNGKI-DO, KOREA, REPUBLIC OF |
|
|
|
RENNER, OTTO, BOISSELLE & SKLAR LLP |
DON W. BULSON |
1621 EUCLID AVENUE |
NINETEENTH FLOOR |
CLEVELAND, OH 44115 |
|
|
Search Results as of:
05/31/2024 07:08 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|