Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09927657
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Filing Dt:
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08/10/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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I-Tseng Lee, Chih-Ming Chung
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Title:
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Chip stack-type semiconductor package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C |
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J.C. PATENTS, INC. |
JIAWEI HUANG |
1340 REYNOLDS AVE., SUITE 114 |
IRVINE, CA 92614 |
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