Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/01/2003
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Application #:
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09025257
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Filing Dt:
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02/18/1998
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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MAKOTO NISHIDA, SHINICHI NAKAMURA
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Title:
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SEMICONDUCTOR PACKAGING PART AND METHOD PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, 5-CHOME, SHINBASHI MINATO-KU |
| TOKYO, JAPAN |
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| WATSON COLE STEVENS DAVIS, P.L.L.C. |
| RICHARD H. TUSHIN, ESQ. |
| 1400 K STREET, N.W. |
| SUITE 1000 |
| WASHINGTON, D.C. 20005-2477 |
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