Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10104975
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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12/05/2002
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Inventor:
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I-Chung Tung
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Title:
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Lamination method of embedding passive components in an organic circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 6, LI-HSIN PARK |
| HSINCHU, TAIWAN R.O.C |
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| RAYMOND SUN |
| 12420 WOODHALL WAY |
| TUSTIN, CALIFORNIA 92782 |
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