Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10210102
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Filing Dt:
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08/02/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Inventors:
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Chia-Lin Hsu, Shao-Chung Hu, Teng-Chun Tsai
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Title:
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Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD., 2 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN R.O.C. |
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| POWELL, GOLDSTEIN, FRAZER & ET AL. |
| THOMAS T. MOGA |
| P. O. BOX 97223 |
| WASHINGTON, DC 20090-7223 |
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