Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/16/2005
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Application #:
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10155089
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Filing Dt:
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05/28/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Inventors:
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Hiroshi Sakai, Motoji Suzuki, Makoto Igarashi, Akihiro Tanaka
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Title:
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METHOD OF PACKAGING ELECTRONIC COMPONENTS WITH HIGH RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEC CORPORATION, 7-1, SHIBA 5-CHOME MINATO-KU |
| TOKYO, JAPAN |
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| DICKSTEIN SHAPIRO MORIN ET AL. |
| STEVEN I. WEISBURD |
| 1177 AVE. OF THE AMERICAS |
| 41ST FL. |
| NEW YORK, NY 10036-2714 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEC CORPORATION, 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 108-8001 |
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| DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP |
| STEVEN I. WIESBURD |
| 1177 AVENUE OF THE AMERICAS, 41ST FLOOR |
| NEW YORK, NY 10036-2714 |
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Assignment:
3
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CORRECTIVE COVERSHEET TO CORRECT THE NAME OF THE ASSIGNEE THAT WAS PREVIOUSLY RECORDED ON REEL 014047, FRAME 0911.
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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| DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP |
| STEVEN I. WEISBURD |
| 1177 AVENUE OF THE AMERICAS, 41ST FLOOR |
| NEW YORK, NY 10036-2714 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE NW, SUITE 800 |
| WASHINGTON, DC 20037 |
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