Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10159348
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Filing Dt:
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05/31/2002
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Publication #:
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Pub Dt:
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12/12/2002
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Inventor:
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Shin Choi
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Title:
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CHIP-SCALED PACKAGE HAVING A SEALED CONNECTION WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICH'ON |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| LADAS & PARRY |
| VANGELIS ECONOMOU |
| 224 SOUTH MICHIGAN AVENUE |
| CHICAGO, IL 60604 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK |
| CHEONGJU CITY, CHUNG CHEONG BOK-DO, KOREA, REPUBLIC OF |
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| MATTHEW T. SMITH |
| DECHERT LLP |
| 4000 BELL ATLANTIC TOWER |
| 1717 ARCH STREET |
| PHILADELPHIA, PA 19103-2793 |
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Assignment:
3
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AFTER-ACQUIRED INTELLECTUAL PROPERTY KUN-PLEDGE AGREEMENT
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| 100 WALL STREET, SUITE 1600 |
| NEW YORK, NEW YORK 10005 |
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| LATHAM & WATKINS LLP |
| 650 TOWN CENTER DRIVE, SUITE 2000 |
| COSTA MESA, CA 92626 |
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