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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
10105454
Filing Dt:
03/26/2002
Publication #:
Pub Dt:
12/19/2002
Inventors:
Yasuo Tomioka, Junji Miyake
Title:
Copper, copper alloy, and manufacturing method therefor
Assignment: 1
Reel/Frame:
012738/0932Recorded: 03/26/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/25/2002
Exec Dt:
02/25/2002
Assignee:
10-1, TRANOMON 2-CHOME, MINATO-KU
TOKYO 105-0001, JAPAN
Correspondent:
OLIFF & BERRIDGE, PLC
WILLIAM P. BERRIDGE
P.O. BOX 19928
ALEXANDDRIA, VA 22320
Assignment: 2
Reel/Frame:
014636/0211Recorded: 05/17/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/27/2004
Assignee:
3, KURAMI, SAMUKAWA-MACHI
KOSA-GUN
KANAGAWA 253-0101, JAPAN
Correspondent:
OLIFF & BERRIDGE, PLC
WILLIAM P. BERRIDGE
P.O. BOX 19928
ALEXANDRIA, VA 22320
Assignment: 3
Reel/Frame:
017710/0231Recorded: 05/25/2006Pages: 11
Conveyance:
MERGER AND CHANGE OF NAME
Assignor:
Exec Dt:
04/03/2006
Assignee:
10-1, TORANOMON 2-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
WILLIAM P. BERRIDGE
OLIFF & BERRIDGE, PLC
P.O. BOX 19928
ALEXANDRIA, VA 22320

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