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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
09957372
Filing Dt:
09/20/2001
Publication #:
Pub Dt:
12/19/2002
Inventor:
Shih-Ping Hsu
Title:
BGA substrate with direct heat dissipating structure
Assignment: 1
Reel/Frame:
012197/0007Recorded: 09/20/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/03/2001
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO. 6, LI-HSIN RD.
HSINCHU, TAIWAN R.O.C
Correspondent:
RAYMOND SUN
12420 WOODHALL WAY
TUSTIN, CA 92782

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