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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6790293
Issue Dt:
09/14/2004
Application #:
10147171
Filing Dt:
05/13/2002
Publication #:
20020195170
Pub Dt:
12/26/2002
Inventors:
Masahiro Nomura, Toshiyuki Oga, Takanobu Gido, Takao Ono, Yoshiyuki Takahashi et al
Title:
SOLDER WORK MATERIAL FOR FORMING SOLDER-COATED CIRCUIT BOARD AND CIRCUIT BOARD
Assignment: 1
Reel/Frame:
012959/0536Recorded: 08/06/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NOMURA, MASAHIRO
Exec Dt:
04/23/2002
OGA, TOSHIYUKI
Exec Dt:
04/23/2002
GIDO, TAKANOBU
Exec Dt:
04/23/2002
ONO, TAKAO
Exec Dt:
04/23/2002
TAKAHASHI, YOSHIYUKI
Exec Dt:
04/23/2002
SASAKI, RIKA
Exec Dt:
05/11/2002
Assignees:
NEC CORPORATION
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
TAMURAKAKEN CORPORATION
IRUMA-SHI
16-2, OAZA SAYAMAGAHARA
SAITAMA, JAPAN 358-8
Correspondent:
ANDREW D. DORISIO
247 NORTH BROADWAY
917-053
LEXINGTON, KY 40507
Assignment: 2
Reel/Frame:
026268/0344Recorded: 05/12/2011Pages: 19
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
TAMURA KAKEN CORPORATION
Exec Dt:
04/01/2010
Assignee:
TAMURA CORPORATION
1-19-43, HIGASHI-OIZUMI, NERIMA-KU
TOKYO, JAPAN 178-8511
Correspondent:
THILO C. AGTHE
100 WALL STREET, 21ST FLOOR
NEW YORK, NY 10005

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