Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10121786
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Filing Dt:
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04/12/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Inventors:
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Chih-Sheng Lu, Lu-Ming Luo, Yaw-Nan Shieh, Ray-Jaung Ho
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Title:
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Copper electroplating composition for integrated circuit interconnection
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7TH FL., 301, SONGKIANG ROAD |
| TAIPEI, TAIWAN R.O.C |
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| EDWARD & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7TH FLOOR, 301, SONGKIANG ROAD |
| TAIPEI, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| RICHARD E. FICHTER |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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