Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/29/2003
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Application #:
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10224360
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Filing Dt:
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08/21/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Inventors:
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Jeng-Jie Peng, Ming-Dou Ker, Nien-Ming Wang
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Title:
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METHOD FOR IMPROVING INTEGRATED CIRCUITS BONDING FIRMNESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG TOWN, HSINCHU HSIEN, TAIWAN |
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| MEYERTONS,HOOD,KIVLIN,KOWERT & GOETZEL |
| 700 LAVACA |
| SUITE 800 |
| AUSTIN, TX 78701 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10TH FL.-1A, NO., 207, DUNHUA N. ROAD |
| TAIPEI CITY 105, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE, SUITE 1404 |
| FALLS CHURCH, VA 22041 |
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