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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
09900333
Filing Dt:
07/06/2001
Publication #:
Pub Dt:
01/09/2003
Inventors:
Kenzo Fujii, Taro Hirai
Title:
Flexible wiring substrate interposed between semiconductor element and circuit substrate
Assignment: 1
Reel/Frame:
011973/0744Recorded: 07/05/2001Pages: 3
Conveyance:
INVALID RECORDING. SEE REEL 012336 FRAME 0268. (RE-RECORD TO CORRECT THE RECORDATION DATE FROM 7-05-01 TO 7-06-01).
Assignors:
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Assignee:
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
HELFGOTT & KARAS, P.C.
SAMSON HELFGOTT
EMPIRE STATE BUILDING
60TH FLOOR
NEW YORK, NY 10118
Assignment: 2
Reel/Frame:
012336/0268Recorded: 07/06/2001Pages: 3
Conveyance:
RE-RECORD TO CORRECT THE RECORDATION DATE OF 07-05-2001 TO 07-06-2001. PREVIOUSLY RECORDED AT REEL 011973 FRAME 0744. ( ASSIGNMENT OF ASSIGNOR'S INTEREST) OR NATURE OF CONVEYANCE
Assignors:
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
HELFGOTT & KARAS, P.C.
SAMSON HELFGOTT
EMPIRE STATE BUILDING
60TH FLOOR
NEW YORK, NEW YORK 10118

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