Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10024936
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Filing Dt:
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12/18/2001
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Publication #:
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Pub Dt:
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01/09/2003
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Inventors:
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Joel Wayne Davenport, Robert R. Parker, Jeff E. Conder
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Title:
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SINGLE PACKAGE CONTAINING MULTIPLE INTEGRATED CIRCUIT DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GROENEWOUDSEWEG 1 |
| EINDHOVEN, NETHERLANDS 5621 |
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| PHILIPS ELECTRONICS NORTH AMERICA CORP. |
| MICHAEL SCHMITT |
| 580 WHITE PLAINS ROAD |
| TARRYTOWN, NY 10591 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| 5656 AG EINDHOVEN, NETHERLANDS |
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| ELIZABETH PARSONS |
| 1825 EYE STREET, NW |
| WASHINGTON, DC 20006 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DAVID M. O'DELL |
| HAYNES AND BOONE, LLP - IP SECTION |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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