Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10157823
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Filing Dt:
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05/31/2002
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Publication #:
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Pub Dt:
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01/09/2003
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Inventors:
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Kazuto Ogasawara, Mitsugu Tanaka, Seiichi Tomihara
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Title:
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MANUFACTURING METHOD OF A BLOCK MOLDING SEMICONDUCTOR DEVICE DIVIDED BY DICING BLADE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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| 145, AZANAKAJIMA, NANAECHO |
| KAMEDA-GUN, HOKKAIDO, JAPAN |
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| MATTINGLY, STANGER & MALUR, P.C. |
| JOHN R. MATTINGLY |
| 18700 DIAGONAL ROAD, SUITE 370 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| JOHN R. MATTINGLY |
| 1800 DIAGONAL RD., SUITE 370 |
| ALEXANDRIA, VA 22314 |
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