Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10232273
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Filing Dt:
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08/30/2002
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Publication #:
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Pub Dt:
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01/16/2003
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Inventors:
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C. P. Lo, Daniel A. Huang, Pete Hudson
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Title:
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METHOD OF ASSEMBLING CHIP SCALE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLDG. 001, M.S. A109 |
| EL SEGUNDO, CALIFORNIA 90245 |
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| THE BOEING COMPANY |
| P.O. BOX 2515 |
| SEAL BEACH, CA 90740 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 NORTH RIVERSIDE PLAZA |
| CHICAGO, ILLINOIS 60606-2016 |
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| STACY CLINE |
| P.O. BOX 2515 |
| MC 110-SD54 |
| SEAL BEACH, CA 90410 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 GREENTREE DRIVE |
| SUITE 101 |
| DOVER, DELAWARE 19904 |
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| STOLOWITZ FORD COWGER LLC |
| 621 SW MORRISON ST |
| SUITE 600 |
| PORTLAND, OR 97205 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 160 GREENTREE DRIVE |
| SUITE 101 |
| DOVER, DELAWARE 19904 |
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| SCHWABE, WILLIAMSON, & WYATT, PC |
| 700 WASHINGTON ST. |
| SUITE 701 |
| VANCOUVER, WA 98660 |
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