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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10197515
Filing Dt:
07/16/2002
Publication #:
Pub Dt:
01/16/2003
Inventors:
Jong Hoon Hahn, Bong Chu Shim, Kyung Won Ro, Yong Min Park
Title:
Assembly microchip using microfluidic breadboard
Assignment: 1
Reel/Frame:
013114/0225Recorded: 07/16/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/03/2002
Exec Dt:
07/03/2002
Exec Dt:
07/03/2002
Exec Dt:
07/03/2002
Assignee:
SAN 31, HYOJA-DONG, NAM-GU
POHANG-SI, KYUNGSANGBUK-DO 790-784, KOREA, REPUBLIC OF
Correspondent:
ANDERSON, KILL & OLICK, P.C.
DAVID EINHORN, ESQ.
1251 AVENUE OF THE AMERICAS, 43RD FLOOR
NEW YORK, NEW YORK 10020-1182

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