Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2004
|
Application #:
|
10066485
|
Filing Dt:
|
02/01/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
|
Inventors:
|
Kuo-Chuan Liu, Michael G. Lee
|
|
Title:
|
METHOD FOR JOINING CONDUCTIVE STRUCTURES AND AN ELECTRICAL CONDUCTIVE ARTICLE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, 211-8588, JAPAN |
|
|
|
|
| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| ATTN: MIKE ENCINAS |
| 333 S. HOPE STREET, 48TH FLOOR |
| LOS ANGELES, CA 90071-1406 |
|
|
Search Results as of:
05/26/2024 12:32 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
