Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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09939480
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Filing Dt:
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08/24/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Inventor:
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Shih-Ping Hsu
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Title:
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METHOD OF FABRICATING VIAS IN SOLDER PADS OF A BALL GRID ARRAY (BGA) SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 6, LI-HSIN RD. |
HSINCHU, TAIWAN R.O.C |
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RAYMOND SUN |
12420 WOODHALL WAY |
TUSTIN, CA 92782 |
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