Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/06/2004
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Application #:
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09924736
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Filing Dt:
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08/07/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Inventors:
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Chun-Cheng Tsao, John Valliant
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Title:
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METHOD FOR GLOBAL DIE THINNING AND POLISHING OF FLIP-CHIP PACKAGED INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150 BAYTECH DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| SKJERVEN MORRILL MACPHERSON LLP |
| NORMAN R. KLIVANS |
| 25 METRO DRIVE, SUITE 700 |
| SAN JOSE, CA 95110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150 BAYTECH DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| SKADDEN, ARPS, SLATE, MEAGHER |
| & FLOM, LLP |
| FREDERICK D. KIM |
| 525 UNIVERSITY AVENUE, SUITE 1100 |
| PALO ALTO, CA 94301 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1421 CALIFORNIA CIRCLE |
| MILPITAS, CALIFORNIA 95035 |
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| DORSEY & WHITNEY LLP |
| GREGORY P. DURBIN |
| 370 SEVENTEENTH STREET |
| SUITE 4700 |
| DENVER, CO 80202-5647 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 45900 NORTHPORT LOOP EAST |
| FREMONT, CALIFORNIA 94538 |
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| NIXON PEABODY LLP |
| 401 NINTH STREET NW, SUITE 900 |
| WASHINGTON, DC 20004 |
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